Publikationen
Suche nach „[T.] [Schweinböck]“ hat 11 Publikationen gefunden
Suchergebnis als PDFZeitschriftenartikel
R. Biberger, Günther Benstetter, T. Schweinböck, Peter Breitschopf, H. Göbel
Intermittent-contact scanning capacitance microscopy versus contact mode SCM applied to 2D dopant profiling
Microelectronics Reliability, vol. 48 (8-9), pp. 1339-1349
Vortrag
Günther Benstetter, Werner Frammelsberger, T. Schweinböck, R. Stamp, J. Kiely
Conducting Atomic Force Microscopy Studies for Reliability Evaluation of Ultrathin SiO2 Films
Final Report
IEEE International Integrated Reliability Workshop, Lake Tahoe, CA, USA
Vortrag
Werner Frammelsberger, Günther Benstetter, T. Schweinböck, R. Stamp, J. Kiely, Peter Breitschopf
Atomic Force Microscopy Studies of Thin and Ultra-thin SiO2 Films
Final Report
2nd VDE World Microtechnologies Congress, München
Beitrag (Sammelband oder Tagungsband)
Werner Frammelsberger, Günther Benstetter, T. Schweinböck, R. Stamp, J. Kiely
Advanced Analysis of Thin and Ultrathin SiO2/Si Interfaces with Combined Atomic Force Microscopy Methods
29th International Symposium for Testing and Failure Analysis, Santa Clara, CA, USA, pp. 406-412
Vortrag
T. Schweinböck, S. Schömann, D. Alvarez, M. Buzzu, Günther Benstetter, Werner Frammelsberger, Peter Breitschopf
New Trends in the application of scanning probe techniques in failure analysis
15th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF), Zürich, Schweiz
Vortrag
Günther Benstetter, Peter Breitschopf, Werner Frammelsberger, Heiko Ranzinger, P. Reislhuber, T. Schweinböck
AFM-based scanning capacitance techniques for deep sub-micron semiconductor failure analysis
15th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF), Zürich, Schweiz
Zeitschriftenartikel
Werner Frammelsberger, Günther Benstetter, R. Stamp, J. Kiely, T. Schweinböck
Simplified tunnelling current calculation for MOS structures with ultra-thin oxides for Conductive Atomic Force Microscopy investigations
Materials Science & Engineering B, vol. 116, no. 2, pp. 168-174
DOI: 10.1016/j.mseb.2004.09.027
Zeitschriftenartikel
Günther Benstetter, Peter Breitschopf, Werner Frammelsberger, Heiko Ranzinger, P. Reislhuber, T. Schweinböck
AFM-based scanning capacitance techniques for deep sub-micron semiconductor failure analysis
Microelectronics Reliability, vol. 44, no. 9-11, pp. 1615-1619
Zeitschriftenartikel
Werner Frammelsberger, Günther Benstetter, T. Schweinböck, R. Stamp, J. Kiely
Characterization of thin and ultrathin SiO2 films and SiO2/Si interfaces with combined conducting and topographic atomic force microscopy
Microelectronics Reliability, vol. 43, no. 1, pp. 1465-1470
Zeitschriftenartikel
T. Schweinböck, S. Schömann, D. Alvarez, M. Buzzu, Günther Benstetter, Werner Frammelsberger, Peter Breitschopf
New Trends in the application of scanning probe techniques in failure analysis
Microelectronics Reliability, vol. 44, no. 9-11, pp. 1541-1546
Vortrag
Werner Frammelsberger, Günther Benstetter, T. Schweinböck, R. Stamp, J. Kiely
Advanced Analysis of Thin and Ultrathin SiO2/Si Interfaces with Combined Atomic Force Microscopy Methods
29th International Symposium for Testing and Failure Analysis, Santa Clara, CA, USA, pp. 406-412