Suche nach „[T.] [Lampke]“ hat 2 Publikationen gefunden
Suchergebnis als PDF
    NachhaltigF: Angewandte Naturwissenschaften und WirtschaftsingenieurwesenS: TC Teisnach Sensorik


    F. Streb, M. Mengel, D. Schweitzer, C. Kasztelan, P. Schoderböck, Günther Ruhl, T. Lampke

    Characterization methods for solid thermal interface materials

    IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 8, no. 6, pp. 1024-1031


    DOI: 10.1109/TCPMT.2017.2748238

    Abstract anzeigen

    Thermal interface materials (TIMs) play a major role in the performance of semiconductor devices by optimizing the thermal contact between device and heatsink. Their influence is further increasing with the usage of novel chip materials such as SiC and GaN. In this methodology study, we compared five of the most established evaluation methods for solid TIMs with each other: transient plane source, LaserFlash, DynTIM, TIMA, and an application-oriented Rth measurement system. We investigated a wide range of typical TIMs in order to explore the limits of the different measurement systems. The results show that, despite existing norms, the used characterization method has a significant influence on the measured thermal conductivity. We also show that the temperature and pressure dependence has a significant influence on the thermal performance of TIMs and that these data need to be included in device specifications. Additionally, detailed error analysis and discussion about sample selection, error influence, and measurement effort for the presented methods are given.

    NachhaltigF: Angewandte Naturwissenschaften und WirtschaftsingenieurwesenS: TC Teisnach Sensorik


    F. Streb, Günther Ruhl, A. Schubert, H. Zeidler, M. Penzel, S. Flemmig, I. Todaro, R. Squatrito, T. Lampke

    Simulations and measurements of annealed pyrolytic graphite-metal composite baseplates

    IOP Conference Series: Materials Science and Engineering, vol. 118, no. Conference 1


    Abstract anzeigen

    We investigated the usability of anisotropic materials as inserts in aluminum-matrix-composite baseplates for typical high performance power semiconductor modules using finite-element simulations and transient plane source measurements. For simulations, several physical modules can be used, which are suitable for different thermal boundary conditions. By comparing different modules and options of heat transfer we found non-isothermal simulations to be closest to reality for temperature distribution at the surface of the heat sink. We optimized the geometry of the graphite inserts for best heat dissipation and based on these results evaluated the thermal resistance of a typical power module using calculation time optimized steady-state simulations. Here we investigated the influence of thermal contact conductance (TCC) between metal matrix and inserts on the heat dissipation. We found improved heat dissipation compared to the plain metal baseplate for a TCC of 200 kW/m2/K and above.To verify the simulations we evaluated cast composite baseplates with two different insert geometries and measured their averaged lateral thermal conductivity using a transient plane source (HotDisk) technique at room temperature. For the composite baseplate we achieved local improvements in heat dissipation compared to the plain metal baseplate.