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Suche nach „[Stefan] [Zorn]“ hat 42 Publikationen gefunden
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    DigitalAngewandte Naturwissenschaften und WirtschaftsingenieurwesenIPH Teisnach

    Zeitschriftenartikel

    Felix Sepaintner, Andreas Scharl, Franz Xaver Röhrl, Werner Bogner, Stefan Zorn

    Characterization and Production of PCB Structures With Increased Ratio of Electromagnetic Field in Air

    IEEE Transactions on Microwave Theory and Techniques, vol. 68, no. 6, pp. 2134-2143

    2020

    DOI: 10.1109/TMTT.2020.2983934

    Abstract anzeigen

    Producing passive printed circuit board (PCB) structures in the millimeter-wave range includes some fundamental challenges, such as low manufacturing costs and high fabrication accuracy. These aspects, in general, have to be combined with low signal attenuation, precise simulation models, and a reliable producibility. This article shows a new method to manufacture different kinds of passive RF waveguides with reduced attenuation and decreased electrical length on low-cost PCB substrates. First, the complex material parameters of the used substrate and the used copper foil are extracted from 10 to 100 GHz to have accurate simulation models in CST Microwave Studio. This is necessary because the parameters provided by the manufacturer are often no longer generally valid in this frequency range. In addition, PCB materials have a significantly higher surface roughness compared with conventional materials for millimeter-wave applications. Therefore, the correct determination and the correct modeling of surface roughness is particularly important. Next, laminate is removed partially on the outer layer of the PCB to increase the electromagnetic field ratio in air. The undesired substrate is removed by a CO2 laser drilling machine by setting narrow drills sequentially. The RF performance of these waveguides is compared with those manufactured in conventional PCB technology according to attenuation and producibility.

    DigitalAngewandte Naturwissenschaften und WirtschaftsingenieurwesenIPH Teisnach

    Zeitschriftenartikel

    E. Hassan, B. Scheiner, F. Michler, M. Berggren, E. Wadbro, Franz Xaver Röhrl, Stefan Zorn, R. Weigel, F. Lurz

    Multi-Layer Topology Optimization of Wideband SIW-to-Waveguide Transitions

    IEEE Transactions on Microwave Theory and Techniques, vol. 68, no. 4, pp. 1326-1339

    2020

    DOI: 10.1109/TMTT.2019.2959759

    Abstract anzeigen

    This article utilizes a topology optimization approach to design planar multilayer transitions between substrate integrated waveguides (SIWs) and rectangular waveguides (RWGs). The optimization problem is formulated based on the modal field analyses and Maxwell's equations in the time domain solved by the finite-difference time-domain (FDTD) method. We present a time-domain boundary condition based on the Klein-Gordon equation to split traveling waves at homogeneous waveguide ports. We employ the boundary condition to compute portal quantities and to devise an adjoint-field system that enabled an efficient computation of the objective function gradient. We solve design problems that include more than 105 000 design variables by using less than 400 solutions of Maxwell's equations. Moreover, a new formulation that effectively combats the development of in-band resonances in the design is presented. The transition configuration allows the direct mount of conventional RWG sections on the circuit board and aims to cover the entire K-band. The guiding structure of the optimized transition requires blind vias, which is realized by a simple and cost-efficient technique. In addition, the transition is optimized for three different setups that can be used to provide different field polarizations. The proposed transitions show less than 1-dB insertion loss and around 15-dB return loss over the frequency interval 18-28 GHz. Several prototypes are fabricated with an excellent match between the simulation and measurement results.

    DigitalAngewandte Naturwissenschaften und WirtschaftsingenieurwesenIPH Teisnach

    Beitrag (Sammelband oder Tagungsband)

    Felix Sepaintner, Andreas Scharl, Florian Keck, Kevin Kunze, Franz Xaver Röhrl, Werner Bogner, Stefan Zorn

    Cost-Effective Implementation of Air-Filled Waveguides on Printed Circuit Boards

    [Invited Talk]

    Proceedings of the IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) [5-7 October 2020; San José, CA, USA]

    2020

    DOI: 10.1109/EPEPS48591.2020.9231382

    Abstract anzeigen

    This paper presents a new cost-effective method to produce air-filled waveguides out of a printed circuit board (PCB) with a milling machine and how to implement them with standard PCB technology. For this purpose, low cost substrates like FR-4 are used. For the baseboard to waveguide transition in the E-Band (60-90GHz) a WR12 waveguide connector [1] was used. The WR12 waveguide was manufactured and analyzed on mechanical deviations. The RF performance in the E-Band was measured and compared to common PCB waveguides like microstrip lines (MS) and grounded coplanar waveguides (GCPW).

    DigitalAngewandte Naturwissenschaften und WirtschaftsingenieurwesenIPH Teisnach

    Beitrag (Sammelband oder Tagungsband)

    Felix Sepaintner, Andreas Scharl, Franz Xaver Röhrl, Werner Bogner, Stefan Zorn

    Extracting Complex PCB Substrate Permittivity from a Transmission Line using the Finite Difference Integral Method from 10 GHz - 100 GHz

    [Invited Talk]

    Proceedings of the 2020 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)

    2020

    DOI: 10.1109/IMWS-AMP49156.2020.9199738

    Abstract anzeigen

    This paper presents a new numerical method to deduce the complex permittivity εr of PCB (printed circuit board) substrates. First, the attenuation and phase of an on board transmission line are measured with a vector network analyzer (VNA). The transmission line is then simulated with the finite difference integral method (FDI) with the substrate substituted by air. The measured and simulated phases are used, to calculate the effective permittivity and the real part of the complex permittivity εr ' . With known εr ' , the electromagnetic field distribution can be calculated, which is necessary to deduce the imaginary part of the permittivity. The shown algorithms can be used for frequencies up to 100 GHz and without any iterative processes.

    DigitalAngewandte Naturwissenschaften und WirtschaftsingenieurwesenIPH Teisnach

    Beitrag (Sammelband oder Tagungsband)

    Andreas Scharl, Felix Sepaintner, Franz Xaver Röhrl, Werner Bogner, Stefan Zorn

    Design and Comparison of Filter Structures in the Millimetre Wave Frequency Range on Outer- and Inner-Layers of Organic Circuits Boards

    [Invited Talk]

    Proceedings of the 2020 European Microwave Conference (EuMC)

    2020

    DigitalAngewandte Naturwissenschaften und WirtschaftsingenieurwesenIPH Teisnach

    Beitrag (Sammelband oder Tagungsband)

    Andreas Scharl, Felix Sepaintner, Franz Xaver Röhrl, Werner Bogner, Stefan Zorn

    Simulation and Measurement of PCB Crossover Structures from DC up to 70 GHz

    [Invited Talk]

    Proceedings of the 2020 German Microwave Conference (GeMiC) [9-11 March 2020; Cottbus]

    2020

    Abstract anzeigen

    In this paper, 4 different crossover structures in a 6-layered printed circuit board (PCB) for high operation frequencies are presented. The design for all structures is based on grounded coplanar waveguide (GCPW). Two fully planar structures, a quasi-coaxial transition and coaxial transition are realized and have a measured bandwidth from DC to 50 GHz and DC to 60 GHz, respectively. Moreover, two structures are designed in submount technology. Especially the connection between baseboard and package (solder junction) plays an important role to guarantee best signal integrity. Therefore, the quality of the solder junction is analysed in detail with TDR (time domain reflectometry) measurement as well as with X-ray images. The submount transitions show good radio frequency (RF) characteristics from DC to 70 GHz.

    DigitalAngewandte Naturwissenschaften und WirtschaftsingenieurwesenIPH Teisnach

    Franz Xaver Röhrl, Siegfried Hildebrand, Johannes Jakob, Stefan Zorn, Werner Bogner

    Projekt NePUMuk (Neue digitale Produktions- und Mikrostrukturierungstechnologien für Anwendungen bis 80 GHz)

    Abschlussbericht

    2019

    DigitalAngewandte Naturwissenschaften und WirtschaftsingenieurwesenIPH Teisnach

    Zeitschriftenartikel

    Franz Xaver Röhrl, Johannes Jakob, Werner Bogner, R. Weigel, Stefan Zorn

    Bare die connections via aerosol jet technology for millimeter wave applications

    International Journal of Microwave and Wireless Technologies, vol. 11, no. Special Issue 5-6 (EuMW 2018 Special Issue (Part I)) [June], pp. 441-446

    2019

    DOI: 10.1017/S1759078719000114

    Abstract anzeigen

    This paper presents a comparison of chip connections using aerosol jet (AJ) and bond technology on low-cost printed circuit board (PCB) substrates. First, the behavior of the used gap filler material and the used silver ink for AJ technology on PCBs are characterized. In addition to comparing the radio frequency (RF) performance (DC to 67 GHz) of the two technologies, the mechanical stability is also compared. While the AJ technology transitions score above all for their RF performance and the lower requirements (surface finish, pad size, and adhesion) on the PCB, the bonding technology has clear advantages, especially with a different coefficient of thermal expansion values of the substrates to be connected. Finally, the measurement results of a complete package are shown, whereby the chip connection is realized once by means of AJ and once by bonding wires.

    DigitalAngewandte Naturwissenschaften und WirtschaftsingenieurwesenIPH Teisnach

    Vortrag

    Johannes Jakob, R. Sammer, Franz Xaver Röhrl, Werner Bogner, Stefan Zorn

    WR12 to planar transmission line transition on organic substrate

    Invited Talk

    49th European Microwave Conference (EuMC), Paris, Frankreich

    2019

    DigitalAngewandte Naturwissenschaften und WirtschaftsingenieurwesenIPH Teisnach

    Vortrag

    Felix Sepaintner, Andreas Scharl, Franz Xaver Röhrl, Werner Bogner, Stefan Zorn

    Simulation and Manufacturing of Low Loss PCB Structures with Additional Electromagnetic Field in Air

    Invited Talk

    IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes (IMWS-AMP), Bochum

    2019

    DigitalAngewandte Naturwissenschaften und WirtschaftsingenieurwesenIPH Teisnach

    Beitrag (Sammelband oder Tagungsband)

    Felix Sepaintner, Andreas Scharl, Franz Xaver Röhrl, Werner Bogner, Stefan Zorn

    Simulation and Manufacturing of Low Loss PCB Structures with Additional Electromagnetic Field in Air

    Proceedings of the IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes (IMWS-AMP) [July 16-18, 2019; Bochum]

    2019

    DOI: 10.1109/IMWS-AMP.2019.8880079

    Abstract anzeigen

    This paper presents a new method to produce different kinds of RF waveguides with reduced attenuation on low cost PCB substrates. First, microstrip (MS) and grounded coplanar waveguides (GCPW) are characterized by considering rough conductors in CST Microwave Studio. Next, laminate is partially removed, to increase the electromagnetic field ratio in air. Accordingly, the dielectric losses are reduced and the electrical length is decreased. These conductors are produced by using a CO 2 laserdrilling machine to remove the undesired substrate. The RF performance (DC to 100 GHz) of these waveguides is compared to transmission lines manufactured in conventional PCB technology. Finally, different kinds of simulated and produced microstrip filters are shown and fabrication tolerances are compared to those produced in standard technology.

    DigitalAngewandte Naturwissenschaften und WirtschaftsingenieurwesenIPH Teisnach

    Beitrag (Sammelband oder Tagungsband)

    Johannes Jakob, R. Sammer, Franz Xaver Röhrl, Stefan Zorn, Werner Bogner

    WR12 to planar transmission line transition on organic substrate

    Proceedings of the 49th European Microwave Conference (EuMC)/European Microwave Week (EuMW) 2019 (September 29-October 4, 2019; Paris, France)

    2019

    DOI: 10.23919/EuMC.2019.8910843

    Abstract anzeigen

    Transitions for planar transmission lines on printed circuit boards to rectangular waveguide are challenging to design and manufacture. This paper introduces two transitions, the first one is a broadband transition from WR12 (60-90 GHz) waveguide to a stripline (SL) and the second is a narrowband transition to a grounded coplanar waveguide (GCPW). The focus at the first transition is based on the fact that signals can be transmitted in the complete E-Band. In the process, many manufacturing possibilities were exploited. For the second transition, the focus was on manufacturability in order to achieve the most cost effective transition possible. Design, simulated and measured results will be presented.

    DigitalAngewandte Naturwissenschaften und WirtschaftsingenieurwesenIPH Teisnach

    Beitrag (Sammelband oder Tagungsband)

    Franz Xaver Röhrl, Johannes Jakob, Werner Bogner, R. Weigel, Stefan Zorn

    Bare Die Connections via Aerosol Jet Technology for Millimeter Wave Applications

    Proceedings of the 48th European Microwave Conference (EuMC)/European Microwave Week (EuMW) 2018 (September 24-28, 2018; Madrid, Spain)

    2018

    DigitalAngewandte Naturwissenschaften und WirtschaftsingenieurwesenIPH Teisnach

    Franz Xaver Röhrl, Siegfried Hildebrand, Johannes Jakob, Stefan Zorn, Werner Bogner

    Projekt NePUMuk (Neue digitale Produktions- und Mikrostrukturierungstechnologien für Anwendungen bis 80 GHz)

    Projektbericht

    2017

    DigitalElektrotechnik und Medientechnik

    Beitrag (Sammelband oder Tagungsband)

    Franz Xaver Röhrl, Roman Sammer, Johannes Jakob, Werner Bogner, R. Weigel, U. Hassel, Stefan Zorn

    Cost-Effective SIW Band-Pass Filters for Millimeter Wave Applications

    Proceedings of the 47th European Microwave Conference (EuMC)/European Microwave Week (EuMW) 2017 (October 8-12, 2017, Nürnberg)

    2017

    DOI: 10.23919/EuMC.2017.8230878

    DigitalSonstige

    Beitrag (Sammelband oder Tagungsband)

    Franz Xaver Röhrl, Johannes Jakob, Werner Bogner, D. Hageneder, Stefan Zorn

    Differential Wideband Interconnects for Organic Millimeter Wave Chip Packages

    An effort to design an all-purpose RF chip package

    Proceedings of the 11th European Microwave Integrated Circuits Conference 2016 (October 03-04 2016, London, UK)

    2016

    DigitalElektrotechnik und Medientechnik

    Beitrag (Sammelband oder Tagungsband)

    Franz Xaver Röhrl, Johannes Jakob, Werner Bogner, D. Hageneder, Stefan Zorn

    Differential Wideband Interconnects for Organic Millimeter Wave Chip Packages

    An effort to design an all-purpose RF chip package

    Proceedings of the 46th European Microwave Conference (EuMC)/European Microwave Week (EuMW) 2016 (October 03-07 2016, London, UK)

    2016

    Elektrotechnik und Medientechnik

    Vortrag

    Stefan Zorn

    High Frequency PCB Design up to 67 GHz

    Workshop

    European Microwave Week 2013, Nürnberg

    2013

    Elektrotechnik und Medientechnik

    Beitrag (Sammelband oder Tagungsband)

    A. Goetz, R. Rose, Stefan Zorn, G. Fischer, R. Weigel

    Performance of Coherent Time Delay Estimation Techniques for Frequency Hopping GSM Signals

    Radio Wireless Week (RWW)/Wireless Sensors and Sensor Networks (WiSNet) 2012, Piscataway, NJ

    2012

    ISBN: 978-1-4577-1237-1

    Abstract anzeigen

    In this paper, the performance of coherent time delay estimation techniques for frequency hopping GSM signals is investigated. It is demonstrated that the techniques enable the usage of a substantially higher bandwidth for time delay estimation and localization purposes compared to state-of-the-art techniques. Since resolution and noise performance directly depend on the applied bandwidth of the signals, major improvements can be realized. For E-GSM 900 systems, an overall bandwidth of up to 35 MHz may be used which enables time delay estimation and localization in the scale of a few meters. The coherent time delay estimation techniques are therefore ideally suited for search and rescue applications.

    Elektrotechnik und Medientechnik

    Beitrag (Sammelband oder Tagungsband)

    Stefan Zorn, M. Gardill, R. Rose, A. Goetz, R. Weigel, A. Koelpin

    A smart jamming system for UMTS/WCDMA cellular phone networks for search and rescue applications

    IEEE/MTT-S International Microwave Symposium digest (MTT), 2012, Piscataway, NJ

    2012

    ISBN: 978-1-4673-1085-7

    DOI: 10.1109/MWSYM.2012.6257769

    Abstract anzeigen

    Recent statistics show an increase in environmental disasters, a fact which is also perceivable to the public as reports of avalanches, earthquakes and landslides mount in media coverage. This paper introduces one part of the I-LOV project, endorsed by the German Federal Ministry of Education and Research. In this project partners from relief organizations, universities and industry investigate enhancements to disaster handling and victim rescue. One possible option is to take advantage of the fact, that a lot of people own a mobile phone today. To locate a person by his or her mobile phone requires to take over the phone by an own Base Transceiver Station (BTS). Jamming all other networks is one option to achieve that. This paper will introduce a new Field Programmable Gate Array (FPGA) based jamming system which disturbs only the absolute necessary parts of the WCDMA spectrum but reliably cuts all connections between mobile stations (MS) and existing BTS. The whole system including the signal generator and the front end will be discussed. Also measurement results will be shown.