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Suche nach „[Sepaintner] [Felix]“ hat 7 Publikationen gefunden
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    DigitalAngewandte Naturwissenschaften und WirtschaftsingenieurwesenIPH Teisnach

    Zeitschriftenartikel

    Felix Sepaintner, Andreas Scharl, Franz Xaver Röhrl, Werner Bogner, Stefan Zorn

    Characterization and Production of PCB Structures With Increased Ratio of Electromagnetic Field in Air

    IEEE Transactions on Microwave Theory and Techniques, vol. 68, no. 6, pp. 2134-2143

    2020

    DOI: 10.1109/TMTT.2020.2983934

    Abstract anzeigen

    Producing passive printed circuit board (PCB) structures in the millimeter-wave range includes some fundamental challenges, such as low manufacturing costs and high fabrication accuracy. These aspects, in general, have to be combined with low signal attenuation, precise simulation models, and a reliable producibility. This article shows a new method to manufacture different kinds of passive RF waveguides with reduced attenuation and decreased electrical length on low-cost PCB substrates. First, the complex material parameters of the used substrate and the used copper foil are extracted from 10 to 100 GHz to have accurate simulation models in CST Microwave Studio. This is necessary because the parameters provided by the manufacturer are often no longer generally valid in this frequency range. In addition, PCB materials have a significantly higher surface roughness compared with conventional materials for millimeter-wave applications. Therefore, the correct determination and the correct modeling of surface roughness is particularly important. Next, laminate is removed partially on the outer layer of the PCB to increase the electromagnetic field ratio in air. The undesired substrate is removed by a CO2 laser drilling machine by setting narrow drills sequentially. The RF performance of these waveguides is compared with those manufactured in conventional PCB technology according to attenuation and producibility.

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    Beitrag (Sammelband oder Tagungsband)

    Felix Sepaintner, Andreas Scharl, Florian Keck, Kevin Kunze, Franz Xaver Röhrl, Werner Bogner, Stefan Zorn

    Cost-Effective Implementation of Air-Filled Waveguides on Printed Circuit Boards

    [Invited Talk]

    Proceedings of the IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) [5-7 October 2020; San José, CA, USA]

    2020

    DOI: 10.1109/EPEPS48591.2020.9231382

    Abstract anzeigen

    This paper presents a new cost-effective method to produce air-filled waveguides out of a printed circuit board (PCB) with a milling machine and how to implement them with standard PCB technology. For this purpose, low cost substrates like FR-4 are used. For the baseboard to waveguide transition in the E-Band (60-90GHz) a WR12 waveguide connector [1] was used. The WR12 waveguide was manufactured and analyzed on mechanical deviations. The RF performance in the E-Band was measured and compared to common PCB waveguides like microstrip lines (MS) and grounded coplanar waveguides (GCPW).

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    Beitrag (Sammelband oder Tagungsband)

    Felix Sepaintner, Andreas Scharl, Franz Xaver Röhrl, Werner Bogner, Stefan Zorn

    Extracting Complex PCB Substrate Permittivity from a Transmission Line using the Finite Difference Integral Method from 10 GHz - 100 GHz

    [Invited Talk]

    Proceedings of the 2020 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)

    2020

    DOI: 10.1109/IMWS-AMP49156.2020.9199738

    Abstract anzeigen

    This paper presents a new numerical method to deduce the complex permittivity εr of PCB (printed circuit board) substrates. First, the attenuation and phase of an on board transmission line are measured with a vector network analyzer (VNA). The transmission line is then simulated with the finite difference integral method (FDI) with the substrate substituted by air. The measured and simulated phases are used, to calculate the effective permittivity and the real part of the complex permittivity εr ' . With known εr ' , the electromagnetic field distribution can be calculated, which is necessary to deduce the imaginary part of the permittivity. The shown algorithms can be used for frequencies up to 100 GHz and without any iterative processes.

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    Beitrag (Sammelband oder Tagungsband)

    Andreas Scharl, Felix Sepaintner, Franz Xaver Röhrl, Werner Bogner, Stefan Zorn

    Design and Comparison of Filter Structures in the Millimetre Wave Frequency Range on Outer- and Inner-Layers of Organic Circuits Boards

    [Invited Talk]

    Proceedings of the 2020 European Microwave Conference (EuMC)

    2020

    DigitalAngewandte Naturwissenschaften und WirtschaftsingenieurwesenIPH Teisnach

    Beitrag (Sammelband oder Tagungsband)

    Andreas Scharl, Felix Sepaintner, Franz Xaver Röhrl, Werner Bogner, Stefan Zorn

    Simulation and Measurement of PCB Crossover Structures from DC up to 70 GHz

    [Invited Talk]

    Proceedings of the 2020 German Microwave Conference (GeMiC) [9-11 March 2020; Cottbus]

    2020

    Abstract anzeigen

    In this paper, 4 different crossover structures in a 6-layered printed circuit board (PCB) for high operation frequencies are presented. The design for all structures is based on grounded coplanar waveguide (GCPW). Two fully planar structures, a quasi-coaxial transition and coaxial transition are realized and have a measured bandwidth from DC to 50 GHz and DC to 60 GHz, respectively. Moreover, two structures are designed in submount technology. Especially the connection between baseboard and package (solder junction) plays an important role to guarantee best signal integrity. Therefore, the quality of the solder junction is analysed in detail with TDR (time domain reflectometry) measurement as well as with X-ray images. The submount transitions show good radio frequency (RF) characteristics from DC to 70 GHz.

    DigitalAngewandte Naturwissenschaften und WirtschaftsingenieurwesenIPH Teisnach

    Vortrag

    Felix Sepaintner, Andreas Scharl, Franz Xaver Röhrl, Werner Bogner, Stefan Zorn

    Simulation and Manufacturing of Low Loss PCB Structures with Additional Electromagnetic Field in Air

    Invited Talk

    IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes (IMWS-AMP), Bochum

    2019

    DigitalAngewandte Naturwissenschaften und WirtschaftsingenieurwesenIPH Teisnach

    Beitrag (Sammelband oder Tagungsband)

    Felix Sepaintner, Andreas Scharl, Franz Xaver Röhrl, Werner Bogner, Stefan Zorn

    Simulation and Manufacturing of Low Loss PCB Structures with Additional Electromagnetic Field in Air

    Proceedings of the IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes (IMWS-AMP) [July 16-18, 2019; Bochum]

    2019

    DOI: 10.1109/IMWS-AMP.2019.8880079

    Abstract anzeigen

    This paper presents a new method to produce different kinds of RF waveguides with reduced attenuation on low cost PCB substrates. First, microstrip (MS) and grounded coplanar waveguides (GCPW) are characterized by considering rough conductors in CST Microwave Studio. Next, laminate is partially removed, to increase the electromagnetic field ratio in air. Accordingly, the dielectric losses are reduced and the electrical length is decreased. These conductors are produced by using a CO 2 laserdrilling machine to remove the undesired substrate. The RF performance (DC to 100 GHz) of these waveguides is compared to transmission lines manufactured in conventional PCB technology. Finally, different kinds of simulated and produced microstrip filters are shown and fabrication tolerances are compared to those produced in standard technology.