Suche nach „[Röhrl] [Franz Xaver]“ hat 12 Publikationen gefunden

NachhaltigAngewandte Naturwissenschaften und WirtschaftsingenieurwesenIPH Teisnach

Zeitschriftenartikel

Werner Bogner, Johannes Jakob, R. Weigel, Franz Xaver Röhrl, Stefan Zorn

Bare die connections via aerosol jet technology for millimeter wave applications

International Journal of Microwave and Wireless Technologies, vol. 11, no. Special Issue 5-6 (EuMW 2018 Special Issue (Part I)) [June], pp. 441-446

2019

DOI: 10.1017/S1759078719000114

Abstract anzeigen

This paper presents a comparison of chip connections using aerosol jet (AJ) and bond technology on low-cost printed circuit board (PCB) substrates. First, the behavior of the used gap filler material and the used silver ink for AJ technology on PCBs are characterized. In addition to comparing the radio frequency (RF) performance (DC to 67 GHz) of the two technologies, the mechanical stability is also compared. While the AJ technology transitions score above all for their RF performance and the lower requirements (surface finish, pad size, and adhesion) on the PCB, the bonding technology has clear advantages, especially with a different coefficient of thermal expansion values of the substrates to be connected. Finally, the measurement results of a complete package are shown, whereby the chip connection is realized once by means of AJ and once by bonding wires.

NachhaltigAngewandte Naturwissenschaften und WirtschaftsingenieurwesenIPH Teisnach

Beitrag (Sammelband oder Tagungsband)

Werner Bogner, Franz Xaver Röhrl, Felix Sepaintner, Stefan Zorn, Andreas Scharl

Simulation and Manufacturing of Low Loss PCB Structures with Additional Electromagnetic Field in Air

Proceedings of the IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes (IMWS-AMP) [July 16-18, 2019; Bochum]

2019

DigitalNachhaltigAngewandte Naturwissenschaften und WirtschaftsingenieurwesenIPH Teisnach

Beitrag (Sammelband oder Tagungsband)

Werner Bogner, Johannes Jakob, R. Sammer, Franz Xaver Röhrl, Stefan Zorn

WR12 to planar transmission line transition on organic substrate

Proceedings of the 49th European Microwave Conference (EuMC)/European Microwave Week (EuMW) 2019 (September 29-October 4, 2019; Paris, France)

2019

NachhaltigAngewandte Naturwissenschaften und WirtschaftsingenieurwesenIPH Teisnach

Beitrag (Sammelband oder Tagungsband)

Werner Bogner, Johannes Jakob, R. Weigel, Franz Xaver Röhrl, Stefan Zorn

Bare Die Connections via Aerosol Jet Technology for Millimeter Wave Applications

Proceedings of the 48th European Microwave Conference (EuMC)/European Microwave Week (EuMW) 2018 (September 24-28, 2018; Madrid, Spain)

2018

NachhaltigElektrotechnik und Medientechnik

Beitrag (Sammelband oder Tagungsband)

Werner Bogner, Johannes Jakob, R. Weigel, U. Hassel, Roman Sammer, Franz Xaver Röhrl, Stefan Zorn

Cost-Effective SIW Band-Pass Filters for Millimeter Wave Applications

Proceedings of the 47th European Microwave Conference (EuMC)/European Microwave Week (EuMW) 2017 (October 8-12, 2017, Nürnberg)

2017

DOI: 10.23919/EuMC.2017.8230878

NachhaltigSonstige

Beitrag (Sammelband oder Tagungsband)

Werner Bogner, Johannes Jakob, Franz Xaver Röhrl, Stefan Zorn, D. Hageneder

Differential Wideband Interconnects for Organic Millimeter Wave Chip Packages

An effort to design an all-purpose RF chip package

Proceedings of the 11th European Microwave Integrated Circuits Conference 2016 (October 03-04 2016, London, UK)

2016

NachhaltigElektrotechnik und Medientechnik

Beitrag (Sammelband oder Tagungsband)

Werner Bogner, Johannes Jakob, Franz Xaver Röhrl, Stefan Zorn, D. Hageneder

Differential Wideband Interconnects for Organic Millimeter Wave Chip Packages

An effort to design an all-purpose RF chip package

Proceedings of the 46th European Microwave Conference (EuMC)/European Microwave Week (EuMW) 2016 (October 03-07 2016, London, UK)

2016

NachhaltigSonstige

Zeitschriftenartikel

T. Dietl, Franz Xaver Röhrl

Thermisches Management für Leiterplatten-basierte Hochfrequenz-Packages

PLUS - Fachzeitschrift für Aufbau und Verbindungstechnik in der Elektronik: Produktion von Leiterplatten und Systemen, no. Dezember

2015

DigitalAngewandte Naturwissenschaften und Wirtschaftsingenieurwesen

Beitrag (Sammelband oder Tagungsband)

Werner Bogner, Johannes Jakob, Franz Xaver Röhrl, D. Hageneder

Wideband RF interconnects for organic chip packages comparison of single ended and differential transitions

An effort to design an all-purpose RF chip package

Proceedings of the 45th European Microwave Conference (EuMC)/European Microwave Week (EuMW) 2015 (September 06-11 2015, Paris, France)

2015

NachhaltigAngewandte Naturwissenschaften und WirtschaftsingenieurwesenIPH Teisnach

Vortrag

Werner Bogner, Johannes Jakob, R. Sammer, Franz Xaver Röhrl, Stefan Zorn

WR12 to planar transmission line transition on organic substrate

Invited Talk

49th European Microwave Conference (EuMC), Paris, Frankreich

NachhaltigAngewandte Naturwissenschaften und WirtschaftsingenieurwesenIPH Teisnach

Vortrag

Werner Bogner, Franz Xaver Röhrl, Felix Sepaintner, Stefan Zorn, Andreas Scharl

Simulation and Manufacturing of Low Loss PCB Structures with Additional Electromagnetic Field in Air

Invited Talk

IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes (IMWS-AMP), Bochum

DigitalNachhaltigAngewandte Naturwissenschaften und WirtschaftsingenieurwesenIPH Teisnach

Werner Bogner, Johannes Jakob, Siegfried Hildebrand, Franz Xaver Röhrl, Stefan Zorn

Projekt NePUMuk (Neue digitale Produktions- und Mikrostrukturierungstechnologien für Anwendungen bis 80 GHz)

Projektbericht