Publikationen
Suche nach „[Röhrl] [Franz Xaver]“ hat 20 Publikationen gefunden
Suchergebnis als PDFBuch (Monographie)
Ein flexibles Leiterplatten-Technologiekonzept für Anwendungen im Millimeterwellenbereich
Dissertationsschrift
Elektrotechnik, München
2020
ISBN: 978-3-8439-4537-0
Zeitschriftenartikel
Felix Sepaintner, Andreas Scharl, Franz Xaver Röhrl, Werner Bogner, Stefan Zorn
Characterization and Production of PCB Structures With Increased Ratio of Electromagnetic Field in Air
IEEE Transactions on Microwave Theory and Techniques, vol. 68, no. 6, pp. 2134-2143
2020
DOI: 10.1109/TMTT.2020.2983934
Zeitschriftenartikel
E. Hassan, B. Scheiner, F. Michler, M. Berggren, E. Wadbro, Franz Xaver Röhrl, Stefan Zorn, R. Weigel, F. Lurz
Multi-Layer Topology Optimization of Wideband SIW-to-Waveguide Transitions
IEEE Transactions on Microwave Theory and Techniques, vol. 68, no. 4, pp. 1326-1339
2020
DOI: 10.1109/TMTT.2019.2959759
Beitrag (Sammelband oder Tagungsband)
Felix Sepaintner, Andreas Scharl, Florian Keck, Kevin Kunze, Franz Xaver Röhrl, Werner Bogner, Stefan Zorn
Cost-Effective Implementation of Air-Filled Waveguides on Printed Circuit Boards
[Invited Talk]
Proceedings of the IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
2020
DOI: 10.1109/EPEPS48591.2020.9231382
Beitrag (Sammelband oder Tagungsband)
Felix Sepaintner, Andreas Scharl, Franz Xaver Röhrl, Werner Bogner, Stefan Zorn
Extracting Complex PCB Substrate Permittivity from a Transmission Line using the Finite Difference Integral Method from 10 GHz - 100 GHz
[Invited Talk]
Proceedings of the 2020 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)
2020
DOI: 10.1109/IMWS-AMP49156.2020.9199738
Beitrag (Sammelband oder Tagungsband)
Andreas Scharl, Felix Sepaintner, Franz Xaver Röhrl, Werner Bogner, Stefan Zorn
Design and Comparison of Filter Structures in the Millimetre Wave Frequency Range on Outer- and Inner-Layers of Organic Circuits Boards
[Invited Talk]
Proceedings of the 2020 European Microwave Conference (EuMC)
2020
Beitrag (Sammelband oder Tagungsband)
Andreas Scharl, Felix Sepaintner, Franz Xaver Röhrl, Werner Bogner, Stefan Zorn
Simulation and Measurement of PCB Crossover Structures from DC up to 70 GHz
[Invited Talk]
Proceedings of the 2020 German Microwave Conference (GeMiC) [9-11 March 2020; Cottbus]
2020
Franz Xaver Röhrl, Siegfried Hildebrand, Johannes Jakob, Stefan Zorn, Werner Bogner
Projekt NePUMuk (Neue digitale Produktions- und Mikrostrukturierungstechnologien für Anwendungen bis 80 GHz)
Abschlussbericht
2019
Zeitschriftenartikel
Franz Xaver Röhrl, Johannes Jakob, Werner Bogner, R. Weigel, Stefan Zorn
Bare die connections via aerosol jet technology for millimeter wave applications
International Journal of Microwave and Wireless Technologies, vol. 11, no. Special Issue 5-6 (EuMW 2018 Special Issue (Part I)) [June], pp. 441-446
2019
DOI: 10.1017/S1759078719000114
Vortrag
Johannes Jakob, R. Sammer, Franz Xaver Röhrl, Werner Bogner, Stefan Zorn
WR12 to planar transmission line transition on organic substrate
Invited Talk
49th European Microwave Conference (EuMC), Paris, Frankreich
2019
Vortrag
Felix Sepaintner, Andreas Scharl, Franz Xaver Röhrl, Werner Bogner, Stefan Zorn
Simulation and Manufacturing of Low Loss PCB Structures with Additional Electromagnetic Field in Air
Invited Talk
IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes (IMWS-AMP), Bochum
2019
Beitrag (Sammelband oder Tagungsband)
Felix Sepaintner, Andreas Scharl, Franz Xaver Röhrl, Werner Bogner, Stefan Zorn
Simulation and Manufacturing of Low Loss PCB Structures with Additional Electromagnetic Field in Air
Proceedings of the IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes (IMWS-AMP) [July 16-18, 2019; Bochum]
2019
DOI: 10.1109/IMWS-AMP.2019.8880079
Beitrag (Sammelband oder Tagungsband)
Johannes Jakob, R. Sammer, Franz Xaver Röhrl, Stefan Zorn, Werner Bogner
WR12 to planar transmission line transition on organic substrate
Proceedings of the 49th European Microwave Conference (EuMC)/European Microwave Week (EuMW) 2019 (September 29-October 4, 2019; Paris, France)
2019
DOI: 10.23919/EuMC.2019.8910843
Beitrag (Sammelband oder Tagungsband)
Franz Xaver Röhrl, Johannes Jakob, Werner Bogner, R. Weigel, Stefan Zorn
Bare Die Connections via Aerosol Jet Technology for Millimeter Wave Applications
Proceedings of the 48th European Microwave Conference (EuMC)/European Microwave Week (EuMW) 2018 (September 24-28, 2018; Madrid, Spain)
2018
Franz Xaver Röhrl, Siegfried Hildebrand, Johannes Jakob, Stefan Zorn, Werner Bogner
Projekt NePUMuk (Neue digitale Produktions- und Mikrostrukturierungstechnologien für Anwendungen bis 80 GHz)
Projektbericht
2017
Beitrag (Sammelband oder Tagungsband)
Franz Xaver Röhrl, Roman Sammer, Johannes Jakob, Werner Bogner, R. Weigel, U. Hassel, Stefan Zorn
Cost-Effective SIW Band-Pass Filters for Millimeter Wave Applications
Proceedings of the 47th European Microwave Conference (EuMC)/European Microwave Week (EuMW) 2017 (October 8-12, 2017, Nürnberg)
2017
Beitrag (Sammelband oder Tagungsband)
Franz Xaver Röhrl, Johannes Jakob, Werner Bogner, D. Hageneder, Stefan Zorn
Differential Wideband Interconnects for Organic Millimeter Wave Chip Packages
An effort to design an all-purpose RF chip package
Proceedings of the 11th European Microwave Integrated Circuits Conference 2016 (October 03-04 2016, London, UK)
2016
Beitrag (Sammelband oder Tagungsband)
Franz Xaver Röhrl, Johannes Jakob, Werner Bogner, D. Hageneder, Stefan Zorn
Differential Wideband Interconnects for Organic Millimeter Wave Chip Packages
An effort to design an all-purpose RF chip package
Proceedings of the 46th European Microwave Conference (EuMC)/European Microwave Week (EuMW) 2016 (October 03-07 2016, London, UK)
2016
Zeitschriftenartikel
Thermisches Management für Leiterplatten-basierte Hochfrequenz-Packages
PLUS - Fachzeitschrift für Aufbau und Verbindungstechnik in der Elektronik: Produktion von Leiterplatten und Systemen, no. Dezember
2015
Beitrag (Sammelband oder Tagungsband)
Franz Xaver Röhrl, Johannes Jakob, Werner Bogner, D. Hageneder
Wideband RF interconnects for organic chip packages comparison of single ended and differential transitions
An effort to design an all-purpose RF chip package
Proceedings of the 45th European Microwave Conference (EuMC)/European Microwave Week (EuMW) 2015 (September 06-11 2015, Paris, France)
2015