Suche nach „[Peter] [Breitschopf]“ hat 12 Publikationen gefunden

Elektrotechnik und MedientechnikIQMA

Zeitschriftenartikel

R. Biberger, Günther Benstetter, T. Schweinböck, Peter Breitschopf, H. Göbel

Intermittent-contact scanning capacitance microscopy versus contact mode SCM applied to 2D dopant profiling

Microelectronics Reliability, vol. 48 (8-9), pp. 1339-1349

Abstract anzeigen

This study compares two different methods of scanning capacitance microscopy (SCM). The first and approved one operates in contact mode and the second novel one in intermittent-contact (IC) mode. Measurements were performed on several samples and the results are compared. New technical expertises on the novel intermittent-contact method are shown and in conclusion assets and drawbacks of this SCM method are emphasized.

Elektrotechnik und MedientechnikIQMAMaschinenbau und Mechatronik

Vortrag

Werner Frammelsberger, Günther Benstetter, T. Schweinböck, R. Stamp, J. Kiely, Peter Breitschopf

Atomic Force Microscopy Studies of Thin and Ultra-thin SiO2 Films

Final Report

2nd VDE World Microtechnologies Congress, München

Elektrotechnik und MedientechnikIQMAMaschinenbau und Mechatronik

Vortrag

Günther Benstetter, Werner Frammelsberger, D. Liu, Peter Breitschopf

Failure analysis of deep sub-micron semiconductor structures and thin films with atomic force microscopy methods

First International conference on Engineering Failure Analysis (ICEFA), Lissabon, Portugal

Elektrotechnik und MedientechnikIQMAMaschinenbau und Mechatronik

Vortrag

Günther Benstetter, Peter Breitschopf, B. Knoll, Edgar Lodermeier, Alexander Hofer, Werner Frammelsberger

Intermittent Contact Scanning Capacitance Microscopy-First Results

Workshop on Scanning Probe Microscopy and Related Techniques, Villach, Österreich

Elektrotechnik und MedientechnikIQMAMaschinenbau und Mechatronik

Vortrag

Günther Benstetter, Werner Frammelsberger, Edgar Lodermeier, Heiko Ranzinger, D. Liu, Peter Breitschopf, W. Bergbauer, Alexander Hofer

Raster-Sonden-Mikroskopie (SPM) in der Fehler- und Zuverlässigkeitsanalytik

VDE Fehlermechanismen bei kleinen Geometrien, Grainau

Elektrotechnik und MedientechnikIQMAMaschinenbau und Mechatronik

Vortrag

Günther Benstetter, Peter Breitschopf, B. Knoll, Werner Frammelsberger

Intermittent contact scanning capacitance microscopy – An improved method for 2D doping profiling

Nanotech Northern Europe, Helsinki, Finnland

Elektrotechnik und MedientechnikIQMAMaschinenbau und Mechatronik

Vortrag

T. Schweinböck, S. Schömann, D. Alvarez, M. Buzzu, Günther Benstetter, Werner Frammelsberger, Peter Breitschopf

New Trends in the application of scanning probe techniques in failure analysis

15th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF), Zürich, Schweiz

Elektrotechnik und MedientechnikIQMAMaschinenbau und Mechatronik

Vortrag

Günther Benstetter, Peter Breitschopf, Werner Frammelsberger, Heiko Ranzinger, P. Reislhuber, T. Schweinböck

AFM-based scanning capacitance techniques for deep sub-micron semiconductor failure analysis

15th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF), Zürich, Schweiz

Elektrotechnik und MedientechnikIQMAMaschinenbau und Mechatronik

Vortrag

Peter Breitschopf, Günther Benstetter, B. Knoll, Werner Frammelsberger

Intermittent contact scanning capacitance microscopy-A novel method for 2D doping profiling

16th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF), Arcachon, Frankreich

Elektrotechnik und MedientechnikIQMAMaschinenbau und Mechatronik

Zeitschriftenartikel

Günther Benstetter, Peter Breitschopf, Werner Frammelsberger, Heiko Ranzinger, P. Reislhuber, T. Schweinböck

AFM-based scanning capacitance techniques for deep sub-micron semiconductor failure analysis

Microelectronics Reliability, vol. 44, no. 9-11, pp. 1615-1619

DOI: 10.1016/j.microrel.2004.07.079

Elektrotechnik und MedientechnikIQMAMaschinenbau und Mechatronik

Zeitschriftenartikel

T. Schweinböck, S. Schömann, D. Alvarez, M. Buzzu, Günther Benstetter, Werner Frammelsberger, Peter Breitschopf

New Trends in the application of scanning probe techniques in failure analysis

Microelectronics Reliability, vol. 44, no. 9-11, pp. 1541-1546

DOI: 10.1016/j.microrel.2004.07.037

Elektrotechnik und MedientechnikIQMAMaschinenbau und Mechatronik

Zeitschriftenartikel

Peter Breitschopf, Günther Benstetter, B. Knoll, Werner Frammelsberger

Intermittent contact scanning capacitance microscopy-A novel method for 2D doping profiling

Microelectronics Reliability, vol. 45, pp. 1568-1571

Abstract anzeigen

In the present study an improved method for 2D doping profiling of semiconductor device structures is presented. The method combines the capabilities of scanning capacitance microscopy (SCM) with the advantages of intermittent contact atomic force microscopy (IC-AFM) and is called intermittent contact scanning capacitance microscopy (IC-SCM). Compared with standard SCM, IC-SCM provides mechanically stable measurement conditions because tip wear is nearly eliminated. Furthermore, background signals without local information are suppressed by demodulating the SCM signal at higher harmonics of the tapping tip frequency. Both, reduced tip wear and higher harmonics demodulation yield improved spatial image resolution at less tip degradation compared with standard SCM.