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    F: Elektrotechnik und MedientechnikI: IQMA

    Zeitschriftenartikel

    V. Iglesias, M. Lanza, K. Zhang, A. Bayerl, M. Porti, M. Nafría, X. Aymerich, Günther Benstetter, Z. Shen, G. Bersuker

    Degradation of polycrystalline HfO2 based gate dielectrics under nanoscale electrical stress

    Applied Physics Letters, vol. 99

    2011

    Abstract anzeigen

    The evolution of the electrical properties of HfO2/SiO2/Si dielectric stacks under electrical stress has been investigated using atomic force microscope-based techniques. The current through the grain boundaries (GBs), which is found to be higher than thorough the grains, is correlated to a higher density of positively charged defects at the GBs. Electrical stress produces different degradation kinetics in the grains and GBs, with a much shorter time to breakdown in the latter, indicating that GBs facilitate dielectric breakdown in high-k gate stacks.